Tousimis Critical point dryers are used to dry any delicate 3D structure that is suffering from surface tension during drying process:

Current MEMS Applications using tousimis® CPD Process are as given below:

• RF Switches
• Cantilevers
• Micro robots
• Inkjet Nozzle
• Shock Sensors
• Coupled Oscillators
• Micro platforms
• Various actuators, hinges, drives, ratchet MEMS devices

Critical point dryers are also used for drying biological samples for subsequent observation under SEM.

For further details, please visit website www.tousimis.com

XYZTEC Bond Testers are used in semiconductor, automotive and raw material industry, following are the bond tests performed on said Bond Testers:

• Ball shear / Solder ball shear
• Bending
• Cavity shear
• Cold Bump Pull
• Copper pillar
• Creep test
• Die shear
• Fatigue
• High speed impact
• Lead integrity / Micro torsion
• Lid pull
• Lid torque
• Loop height
• Overhanging die
• Passivation layer gold ball shear
• Probe test
• Ribbon peel
• Ribbon pull
• Scratch / coating
• SMD shear
• SMD gull wing leads
• Spring rigidity
• Stud pull
• Total Ball Shear / Zone shear
• Tweezer pull
• Vector pull
• Wedge and ribbon shear
• Wire pull

For further details, please visit website https://www.xyztec.com/en/

TPT Wire Bonders are used in the development and production of microchips, following are the application :

• Wedge Bonding
• Ball Bonding
• Ribbon Bonding
• Bump Bonding
• Coated Wire Bonding
• Insulated Wire Bonding
• Insulated Wire Bonding
• Heavy Wire

For further details, please visit website www.tpt-wirebonder.com

Hesse-Mechatronics Fully automated Wedge-Wedge Bonders, software for monitoring ultrasonic-bond-processes, ultrasonic Flip-Chip Bonders are used in following Industry :

• Semiconductor Industry
• Automotive Industry
• E-Mobility/ Electric Vehicles
• Industrial Automation
• Electronic Manufacturing Services (EMS)
• Medical Technology
• Electronic Industry
• Power Semiconductor
• Aerospace
• Lighting/ LED
• Renewable Energy

For further details, please visit website www.hesse-mechatronics.com

NTG products are used in the following fields:

• Ion Beam Processing

Ion Beam Figuring Plants is used for nanometer precise correction of surface errors. IBF(Ion Beam Figuring)-technology is needed when the required quality of the surface cannot be achieved by using conventional polishing techniques.

Ion Beam Etching Systems is used for production of high end optics

• Particle Accelerators
• Vacuum Technology
• Customization

For further details, please visit website www.ntg.de

Budatec Vacuum soldering systems, ranging from small batch plants to fully automated production systems is used for the semiconductor and solar industry fields. Below are some applications:

• Execution of sample soldering
• Contract Manufacturing
• Development and construction of solder fixings

For further details, please visit website www.budatec.de