Tousimis Research Corporation was originally organized in 1962 in the District of Columbia, Washington, DC by our Founder Dr. AJ Tousimis. “ Dr.T’s” goal was always and still is to develop new advanced instrumentation to be used in the world’s most advanced laboratories. This idea has been the goal of our company for over half a century. Tousimis products are still designed and fabricated today in the USA and are known for their ease of use, reliability and highest possible quality helping insure the reliability of your results.

Some typical applications where Tousimis critical point dryers are used by hundreds of facilities worldwide are: MEMS, BIO-MEMS, Biological drying for SEM observation, AERO-GEL, Metal Organic Framework (MOF), Hydro-GELs, Entomology and others.

We are proud to partner with Mcube Technologies for all or your sales and service support throughout India.

For more details, please Contact MCube Technologies or visit Tousimis Research Corporation website

XYZTEC is the market and technology leader in bond testing and are 100% focused on bond testing and have established their name as technology leader in bond testing worldwide.

XYZTEC is a high technology based company, applying mechatronics and electronics, advanced precision mechanics and dedicated software to design innovative equipment that is used to control the quality of bonds of industrial products.

Their equipment is used worldwide in the semiconductor, automotive and raw material industry.

For more details, please contact MCube Technologies or visit web site www.xyztec.com

Manufacturer of wire bonders (manual, semiautomatic & automatic machines), wedge bond, ball bond.

For more details, please contact MCube Technologies or visit web site www.tpt.de

Hesse Mechatronics is one of the world’s leading producers of fully automated Wedge-Wedge Bonders, ultrasonic Flip-Chip Bonders as well as special bonding tools for Electronic vehicle battery bonding applications.

For more details, please contact MCube Technologies or visit web site www.hesse-mechatronics.com

NTG Neue Technologien is one of the world’s leading innovator and manufacturer of High End Ion Beam Etching Systems and Ion Beam Figuring systems for production of high end optics. NTG also manufacture specialized components and highly complex chambers for particle acceleration beam line applications.

For more details, please contact MCube Technologies or visit web site www.ntg.de

Budatec GmbH is leading manufacturer of vacuum soldering & sintering machines for the semiconductor and solar industry ranging from small batch plants to fully automated production systems.

In this segment, budatec GmbH is one of the technological market leaders, for thermal processes involving especially use of hydrogen and plasma gases.

For more details, please contact MCube Technologies or visit web site www.budatec.com

SVCS Process Innovation designs and manufactures batch horizontal and vertical diffusion, PECVD and LPCVD furnaces for the semiconductor and photovoltaic industries, or related R&D institutes.

For further details please visit website www.svcs.com

Finetech is the leading equipment manufacturer for sub-micron die bonding & advanced SMD rework. They provide solutions for each stage of your journey - from R&D to industrial automated production.

For further details please visit website www.finetech.de

MARTIN is a globally active company in the field of developing REWORK and DISPENSE systems for customers from various industries. They offer precise, fast, handy and intuitive devices for all necessary work steps. Their product range is divided into two areas: REWORK and DISPENSE

For further details please visit website www.martin-smt.de

Powatec GmbH are into manufacturing and service operation specializing in the development, production and sale of products for the semiconductor industry in the backend area – e.g., Wafer Mounter, Laminator, UV curing stations, as well as accessories such as frames, films, magazines. They also offer a dicing service for slicing of silicon, glass and ceramic wafers.

For further details please visit website www.powatec.com

PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services. Their advanced packaging equipment portfolio incorporates several core technologies including laser soldering and wire soldering, laser assisted bonding and innovative wafer level bumping solutions such as electroless plating and wafer level ball placement. They offer equipment solutions for high throughput and fully automated manufacturing as well as advanced research and development field work.

For further details please visit website www.pactech.com

Diamond WireTec GmbH & Co.KG develops, produces and sells diamond wire saws as well as diamond wires and accessories worldwide.

Their diamond wire saws are primarily used in industrial laboratories and engineering offices as well as in institutes and universities. The applications are mostly in research, development and quality assurance with the analysis of materials and components.

The cutting process with diamond wire saws offers several advantages over conventional cutting processes.

For further details please visit website www.diamondwiretec.com